Top pcb assembly service manufacturer? Since beginning, as a printed circuit board (PCB) vendor in Asia, Best Technology is dedicating to be your best partner of advance, high-precision printed circuit boards, such as heavy copper boards, ultra thin PCB, mixed layers, high TG, HDI, high frequency (Rogers, Taconic), impedance controlled board, Metal Core PCB (MCPCB) such as Aluminum PCB, Copper PCB, and Ceramic PCB (conductor Copper, AgPd, Au, etc) and so on. Discover extra information on pcb manufacturer. A PCB is sort of like a layer cake or lasagna- there are alternating layers of different materials which are laminated together with heat and adhesive such that the result is a single object. The base material, or substrate, is usually fiberglass. Historically, the most common designator for this fiberglass is “FR4”. This solid core gives the PCB its rigidity and thickness. There are also flexible PCBs built on flexible high-temperature plastic (Kapton or the equivalent). You will find many different thickness PCBs; the most common thickness for PCB & MCPCB products is 1.6mm (0.063″). Some of our products- Best Technology boards and Arudino Pro Micro boards- use a 0.8mm thick board.
Best Through Hole Technology assemble more than 50 kinds components Factory Price. We offer a complete range of through hole PCB assembly capabilities in compliance with IPC quality standards. We provide Through Hole Technology (THT) PCBA service at the highest quality level and in a cost-effective manner. Our through hole technology (THT) PCB Assembly services includes both manual and automated techniques. While our manual soldering techniques can handle complex assemblies, the automated ones are best suited for high volume production as well as reduced material handling. We provide THT PCBA service at the highest quality level and in a cost-effective manner. Equipment: We purchased many advanced, art-of-state machines & devices for PCB manufacturing, checking, to improve the quality of our boards.
In order to provide one-stop-services to customers, we can also provide FPC and Rigid-flex PCB Assembly service (also named SMT: Surface Mounting Technology). We can purchase all components from abroad or domestic market, and provide full products to you with short lead time. High Density Interconnects (HDI) board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<100 µm), smaller vias (<150 µm) and capture pads (300, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology. HDI board is used to reduce size and weight, as well as to enhance electrical performance.
PCB or Printed Circuit Board is the traditional name for the bare board of which you supply us with the layout data and which you use to mount your components on once we have delivered it to you. A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or signal traces etched from copper sheets laminated onto a non-conductive substrate.
According to different manufacturing method, current there’re three basic types for ceramic board: A) Thick Film Ceramic Board Thick Film Ceramic PCB: Using this technology, the thickness of conductor layer exceeds 10 micron, more thick than spurting technology. The conductor is silver or gold palladium, and was printed on ceramic substrate. More for Thick Film Ceramic PCB. B) DCB Ceramic Board DCB (Direct Copper Bonded) technology denotes a special process in which the copper foil and the core (Al2O3 or ALN), on one or both sides, are directly bonded under appropriate high temperature and pressure. Find more info at https://www.bstpcb.com/.
Advantage of MCPCB: Some LEDs dissipate between 2-5W of heat and failures occur when the heat from a LED is not properly removed; a LED’s light output is reduced as well as degradation when the heat remains stagnant in the LED package. The purpose of a MCPCB is to efficiently remove the heat from all topical IC’s (not just LEDs). The aluminum base and thermally conductive dielectric layer act as bridges between the IC’s and heat sink. One single heat sink is mounted directly to the aluminum base eliminating the need for multiple heat sinks on top of the surface mounted components.